| 摘要:LED铝基板绝缘层的导热能力是影响大功率LED基板应用的主要因素。本文通过在环氧树脂中添加纳米级高导热填充物氧化铝、碳化硅、二氧化硅来提高绝缘层的导热能力，重点探讨填料种类、含量对基板绝缘层性能的影响，优化了填料配方，采用红外热像仪分析基板表面温度分布情况，通过散热实验测试铝基板的散热效果，结果证明导热效果良好。 |
| 关键词: LED基板 高导热 导热填充物 绝缘 |
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| Research on Heat Scattering Properties of LED metal board by adding Nano powders |
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| Abstract:The capacity of LED metal board with board heat scattering is main fator of substrate application，the method to enhance thermal conductivity by introducing Nanometer High Thermal Conductivity Filler，Al2O3，SiC，SiO2，and the article investigates on the effects of the filler of the class and content on properties of the material board，optimizes filler formula，analyses the distributing situation of surface temperature by thermal infrared imager. The study proves that thermal conductivity of LED metal board is available. |
| Key words: LED Substrate High Thermal Conductivity Thermal Conductivity of Filler Insulation |