| 摘要: |
| 设计制作了一款基于微组装工艺的小型化低噪声放大器（LNA）。该器件广泛选用裸管芯、芯片电容等微型器件，采用两级放大电路结构，使用AWR与HFSS电磁仿真软件进行设计、优化和仿真，运用键合金丝微波特性进行噪声系数调试，实现较好的低噪声微波特性。最终实现了在12.25GHz-12.75GHz 工作频段，增益大于20dB，噪声系数小于1.2dB的低噪声放大器，整体电路尺寸仅为12mm×10mm×7mm。 |
| 关键词: 低噪声放大器，小型化，键合金丝，微组装，AWR，HFSS |
| DOI： |
|
| 基金项目:国家自然科学基金 |
|
| Design of a compact Ku band low noise amplifier |
|
| () |
| Abstract: |
| A compact and low noise amplifier（LNA）was designed and fabricated, by using the micro-assembly process. Micro components were widely selected such as dies, chip capacitors and others. Based on a two stage structure, the circuit EM design, optimization and analysis were realized in AWR and HFSS. The bonding wire based micro-assembly adjustment method was obtained to achieve a low noise performance. The fabricated LNA was under a working range from 12.25GHz to 12.75GHz, with an associated gain of 20dB and noise figure as low as 1.2dB. The final product size was only 12mm×10mm×7mm. |
| Key words: LNA, downsized, bonding wire, micro assembly, AWR, HFSS |